System-level Thermal Modeling and Power/Thermal Management
COM2 Level 2
MR3, COM2-02-26
Abstract:
This talk consists of two parts: 1) thermal modeling and 2) power/thermal management. In the first part, I will present our practical thermal modeling techniques which was validated against a commercial application processor. In the second part, I will present software power/thermal management techniques, which is easy to understand intuitively; I believe only simple techniques can be adopted by industry. In the mobile devices, multimedia applications are very popular, where there is a specific thread for audio playback. By detecting the thread, DVFS and scheduling are coordinated to save power consumption. And I will explain the difference between battery consumption and energy consumption, which should be carefully considered to evaluate battery lifetime. Lastly, I will present the state-of-the art thermal management techniques for mobile devices depending on migration as well as DVFS. All the evaluation results are based on measurement of commercial smartphones rather than simulation.
Biodata:
Sung Woo Chung received the BS and PhD degrees in Electrical Engineering and Computer Science from Seoul National University, in 1996 and 2003, respectively. He was a senior engineer in Samsung Electronics from 2003 to 2005. In 2005, He was a research scientist in University of Virginia. Since 2006, he has been a professor in the Department of Computer Science, Korea University, Seoul, Korea. His research interests include low-power design, temperature-aware design, and user-aware design. He had been an Associate Editor of IEEE Transactions on Computers from 2010 to 2015. He was the Technical Program Co-Chair of the IEEE International Conference on Computer Design in 2015. He serves (and served) on the technical program committees in many conferences, including Design Automation Conference (2015-2018), International Symposium on Low Power Electronics and Design (2016-2019), and International Parallel and Distributed Processing Symposium (2017-2018).
He is a senior member of IEEE.